| 摘要 |
A semiconductor assembly comprises a semiconductor die having a circuit side with circuitry thereon, a lead frame, and an attachment structure for securing the die to the lead frame. The attachment structure comprises a carrier, an adhesive interposed between the carrier and the lead frame which attaches the carrier to the lead frame, and a paste interposed between the carrier and the circuit side of the die which attaches the carrier to the die. A method for attaching a semiconductor device to a lead frame comprises the steps of providing an attachment structure comprising a carrier having first and second sides and an adhesive on the first side of the carrier, the carrier attached to a lead frame by the adhesive. Next, a paste is dispensed on the second side of the carrier. A surface of the semiconductor die including circuitry is then contacted with the paste and the paste is cured.
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