| 摘要 |
PROBLEM TO BE SOLVED: To provide good flatness in a semiconductor substrate after polishing, also increase a yield so as to improve productivity. SOLUTION: A contact type correction unit 6 is arranged in the upstream in the rotational direction of a polishing table 1. By this correction unit, 6 deformation of a polishing pad, so-called rebound, can be moved from a peripheral position of a wafer 2 to an edge part of the correction unit 6, that is, to an edge part position of the correction unit 6 on a reverse side to an edge part in a side of the wafer 2 facing it. In this way, since the correction unit 6 is pressed to a friction pad, good flatness is obtained in a peripheral part of the wafer 2, a yield is increased. |
