Aqueous acrylic photopolymerisable compositions

摘要

Photopolymerisable compositions are described which comprise a) 20 to 80% by weight of a specific film-forming, acid group-containing acrylate of higher molecular weight which is neutralised with ammonia or an amine or an inorganic base, at least 10% by weight of component a) consisting of a acrylate of higher molecular weight which is derived from a reaction product of a polymolecular epoxy resin that is advanced with a bisphenol and an ethylenically unsaturated monocarboxylic acid and after subsequent reaction with a cyclic anhydride of an organic polycarboxylic acid, b) 0.1 to 15% by weight of a photoinitiator, c) 1 to 25% by weight of optional components, and d) water, as well as e) at least one additional optional (meth)acrylate monomer or (meth)acrylate oligomer or a vinyl compound that can be crosslinked with light. The compositions contain no additional polymolecular polymer binders and which can be used as aqueous applicable photoresist compositions, preferably for coating printed circuit boards. The coatings obtained therefrom are non-tacky after drying and have good edge coverage.