发明名称 |
Applying semiconductor laser mirror layers after securing support plate to laser body |
摘要 |
A method for manufacturing a semiconductor component having a semiconductor body secured to a support plate comprises securing the support plate on a surface of the semiconductor body before applying the cover layers which form mirrors on the end surfaces of the semiconductor body. The support plate is preferably made of an electrically and thermally conducting material which has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the semiconductor body.
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申请公布号 |
US5943553(A) |
申请公布日期 |
1999.08.24 |
申请号 |
US19960723831 |
申请日期 |
1996.09.30 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SPAETH, WERNER |
分类号 |
H01S5/00;H01L33/64;H01S5/02;H01S5/028;(IPC1-7):H01S3/025 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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