发明名称 ALKALI-SOLUBLE CURABLE RESIN, ITS PRODUCTION, CURABLE RESIN COMPOSITION AND ITS FORMED FILM MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain the subject resin capable of exhibiting excellent photosensitivity, aqueous alkali developing properties and toughness, adhesivity, heat resistance, etc., after curing, useful as a liquid resist material, etc., by making an unsaturated double bond and a carboxyl pendant from the OH of a phenoxy resin. SOLUTION: This alkali-soluble curable resin is shown by the formula [Ar<1> to Ar<3> are each H, a halogen or a dihydric aromatic phenol residue containing an (ether bond-containing) 1-12C hydrocarbon group as a substituent group; Ar<4> is Ar<1> to Ar<3> ; R is H or methyl; R' is a 2-20C aliphatic, alicyclic or (substituted) aromatic polyfunctional carboxylic acid residue; (x) and (z) are each 0 or 1; (y) is 1 or 2; (p), (q), (r) and (s) are each a mol fraction of each structural unit and are 0-0.3, 0.2-0.6, 0.1-0.8 and 0-0. 3 respectively and p+q+r+s=1] and is obtained, for example, by reacting the side chain OH of a corresponding phenoxy resin with a fixed amount of a part of anα,β-unsaturated monoisocyanate (Z), then a fixed amount of a polyfunctional carboxylic acid anhydride and the rest of (Z) in this order.
申请公布号 JPH11228689(A) 申请公布日期 1999.08.24
申请号 JP19980028530 申请日期 1998.02.10
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 CHIYOU ISHIYUU;KAKU SHIGE;YOSHIDA HARUO;HANIYUDA TOSHIAKI
分类号 G03F7/027;C08F2/48;C08F290/14;C08F299/02;C08G65/48;C08K3/00;C08K5/00;C08L71/00;(IPC1-7):C08G65/48 主分类号 G03F7/027
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