发明名称 |
Kunststofformeinrichtung für Halbleiterbauelemente und Kunststofformverfahren zum Umwandeln von Halbleiterbauelementen |
摘要 |
A plastic molding apparatus for semiconductor devices includes a first evacuation passage via which an ejector chamber in a lower die chase block is evacuated through a lower die common surface table, a second evacuation passage via which an ejector chamber in the upper die chase block is evacuated through the upper die common surface table, and a third evacuation passage via which a parting chamber on a parting surface between the lower die chase block and the upper die chase block is evacuated through one of the lower die common surface table and the upper die common surface table. Since the evacuation passages are separate and the volume of the evacuation chamber is reduced, evacuation performance is improved and the size of the apparatus is reduced. The plastic packaging performance is also improved. |
申请公布号 |
DE4329311(C2) |
申请公布日期 |
1999.08.19 |
申请号 |
DE19934329311 |
申请日期 |
1993.08.31 |
申请人 |
MITSUBISHI DENKI K.K. |
发明人 |
TANAKA, SUEYOSHI;SAKAKIBARA, ZYUNZI;TSUTSUMI, YASUTSUGU |
分类号 |
B29C45/14;B29C45/26;B29C45/34;H01L21/00;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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