Semiconductor pressure sensor based on strain gauge principle

摘要

The sensor has a case (4) with a mounting (2) supporting a semiconductor chip (1) for measuring pressure. The base plate (3) of the mounting has a central hole (30), a concentric pressure-conducting hole (40) and a groove (7a,7b), which surrounds the mount inside the bonding region for the chip. This configuration makes it possible to reduce deformation inside the groove created by external forces and prevent external force being exerted on the chip in an unacceptable manner.