Method for separating required chips from semiconductor wafer

摘要

The method involves using a laser beam, whose optical axis for scanning an x-y plane is controlled by a digital scanning control device. Severing raster distances are input along an x and a y axis, corresponding to the chip dimensions, of a scanning control device. The co-ordinates of a non-scored line region with respect to the control device are determined for the above input step. Then the scored lines are formed by laser irradiation, except in the non-scored line region. The control device carries out scanning of the laser beam optical axis over the wafer in the determined raster spacing along an x and y directions. The optical axis then scans in the other direction in the raster spacing for chip severing.