Substrate manipulation and holding apparatus used for silicon wafer etching e.g. for manufacturing micro-mechanical pressure or mass flow sensors

摘要

Silicon wafers, to be etched, are provided with plastic edge protectors which can be mechanically and electrically connected to a wafer carrier. Manipulating and holding substrates, especially silicon wafers during etching, comprises providing each wafer edge with an etchant-resistant and sealing casing which has a device for mechanical and electrical connection to a carrier for dipping into an etching bath. The insulating edge casing comprises an edge protector of plastic. An Independent claim is also included for an apparatus for carrying out the above process. Preferred Features: The edge protector (3) comprises two thermoplastic moldings joined together by welding or two elastomeric moldings joined together by vulcanization.