| 摘要 |
<p>An apparatus for placing components on a substrate is provided, the apparatus comprising: (i) one or more component holders for placing components on the substrate, the said component holder(s) being mounted on one or more bars; (ii) a pair of guide rails, the bar(s) being mounted on the guide rails by means of mounts which can move along the guide rails; (iii) control means for setting a variety of orientations of the component holder(s) relative to the substrate by varying the locations of the moveable mounts on the guide rails. The apparatus can be used to assemble components onto printed circuit boards. The apparatus provides high components onto printed circuit boards. The apparatus provides high component placement precision, mechanical simplicity and a high component through-put.</p> |
