发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device has a plurality of transistor units each of which is constituted by a unit prepared by arranging a plurality of unit cells each made up of a drain, gate, and source adjacent to each other on the major surface of a semiconductor substrate, a gate extraction electrode (12b) which extends in a direction perpendicular to the longitudinal direction of the gate and is commonly connected to the gate of the unit cells, a drain extraction electrode (12a) which is positioned at a side where the drain extraction electrode faces the gate extraction electrode (12b) via the unit, extends in a direction perpendicular to the longitudinal direction of the drain, and is commonly connected to the drains of the unit cells, a gate pad (221) connected to the gate extraction electrode (12b) and a drain pad (211) connected to the drain extraction electrodes (12a). The gate pads (221) of adjacent transistor units are connected to each other by a gate extraction electrode connection wiring line (12) having a resistor (27) of 0.6 to 10 OMEGA . The drain pads (211) are connected to each other by a drain extraction electrode connection wiring line (241). A method of manufacturing this semiconductor device is also disclosed. <IMAGE>
申请公布号 EP0936669(A1) 申请公布日期 1999.08.18
申请号 EP19990102990 申请日期 1999.02.15
申请人 NEC CORPORATION 发明人 INOUE, TOSHIAKI;WATANABE, TOSHIROU
分类号 H01L21/60;H01L21/8234;H01L23/482;H01L27/06;H01L27/088;H01L29/417;H01L29/423;H01L29/43;H01L29/78 主分类号 H01L21/60
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