| 摘要 |
A device 103 such as a chip, resistor, or capacitor is mounted on a substrate 201 via mount resin 108 and has wires 104 thereof connected to electrodes 207 arranged on the substrate for wire bonding by conductors. A frame 230 for preventing the mount resin from flowing out is formed as a barrier on the substrate between a portion for mounting the device and the electrodes 207 for wire bonding. The frame may be formed by screen printing solder resist and the substrate may be a printed circuit board. The device 103 and wires 104 are embedded in resin 106. |
