| 摘要 |
<p>The present invention relates to a multi-layer film for use as a thermoforming film, consisting of one or more polyamide-containing layers (I, I', I", etc.), a layer sequence (II) on the sealing outer face of the film, optionally one or more EVOHcontaining layers (III, III', III", etc.) and optionally further layers also, wherein the multi-layer film has a water content of at least 0.5 and at most 2.5 % by weight, with respect to the total weight of the PA- and EVOH-containing layers, before processing to form a hollow.</p> |
