Depositing a selected pattern of solder droplets onto a substrate on which one or more electronic components are to be mounted, the substrate being mounted on a substrate support and moved relative to a solder ejector along a scan axis, the droplets being deflected along a fan axis that is transverse to the scan axis by selectively applying a charge and passing the charged droplets through an electric field.
申请公布号
US5938102(A)
申请公布日期
1999.08.17
申请号
US19960583641
申请日期
1996.01.05
申请人
MUNTZ, ERIC PHILLIP;ORME-MARMARELIS, MELISSA E.;PHAM-VAN-DIEP, GERALD C.;BALOG, ROBERT J.
发明人
MUNTZ, ERIC PHILLIP;ORME-MARMARELIS, MELISSA E.;PHAM-VAN-DIEP, GERALD C.;BALOG, ROBERT J.