| 摘要 |
PROBLEM TO BE SOLVED: To simplify the transfer route of a wafer substrate so as to improve a semiconductor device in production efficiency and furthermore to dispense with a large clean room by a method wherein unit process groups are arranged in series along a main wafer substrate transfer route. SOLUTION: An automatic transfer vehicle 8 mounted with closed-type clean boxes where wafer substrates are housed is moved to transfer the clean boxes to process boxes P1 to P5 in regular order. At first, the clean box is introduced into the process box P1 through the inlet/outlet 9 of the process box P1 . The wafer substrate introduced into the process box P1 is subjected to a process where a P-type layer 2 is formed on the wafer substrate. The processed wafer substrate is returned to the clean box, and the clean box is moved to the adjacent process box P2 , by the automatic transfer vehicle 8. The wafer substrate is subjected to a necessary process in the process box P2 , and then the clean box is moved to the adjacent process box P3 . The wafer substrate is successively subjected to necessary processes in the process boxes P4 and P5 for the manufacture of a product. |
