| 摘要 |
PCT No. PCT/DE96/00103 Sec. 371 Date Jul. 18, 1997 Sec. 102(e) Date Jul. 18, 1997 PCT Filed Jan. 17, 1996 PCT Pub. No. WO96/22256 PCT Pub. Date Jul. 25, 1996The invention relates to a method of anodic bonding and a method for producing glass coatings for purposes of anodic bonding and colloidal solutions suitable for this purpose. The method is particularly suitable for anodic bonding with glass coatings with a thickness of greater than 100 nm up to 10 mu m, which are used for connecting two semiconductor layers. In order to produce the required glass coating, an SiO2-sol is dissolved in at least one or in a mixture of n-alkanols (n=1 to 5). Then tetraethyl orthosilicate (TEOS), methyl triethoxysilane (MTEOS) and water are added to this organosol. Furthermore, a small quantity of acid is added to the desired quantity of alkali salts, and the colloidal solution is at least partly polymerized. The colloidal solution thus obtained is suitable for coating conductive materials by cost-effective methods such as immersion, spin-on deposition or spraying and subsequent tempering. After one coating there results a glass coating with a thickness of up to 2 mu m. When the method is repeated a plurality of times, coating thicknesses of over 10 mu m can be obtained. |
