| 摘要 |
PROBLEM TO BE SOLVED: To provide a resist pattern forming method by which a resist pattern having excellent sensitivity, resolution, resist peeling property, adhesion property with a substrate, etching durability or plating durability can be formed in a short time with high production yield. SOLUTION: In this method, a layer of the photosensitive resin compsn. described below is formed on a metal substrate surface, exposed, developed and irradiated with active rays. The photosensitive resin compsn. contains a base polymer having 95 to 250 mgKOH/g acid value and 5000 to 200000 weight average mol.wt., an ethylene unsatd. compd. containing >=50 wt.% ethylene oxide-modified trimethylol propane triacrylate, and a self-opening initiator. |
