CHIP CARRIER SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package capable of having a package crack resistant characteristic which is substantially equivalent to those of prior art semiconductor packages and also having superior temperature resistant cycle characteristic. SOLUTION: A polyimide bonding sheet 1 coated on its both sides of polyimide films with a polyimide adhesive is formed with outer connection parts 3 and venting holes 11 through drilling. A copper foil is bonded onto the sheet to form inner connection parts and developing wiring patterns 2 (step a). A film-like adhesive made of laminated first and second die bond films 4 and 6 is bonded on a semiconductor-ship mounting region of a carrier substrate (step b). Semiconductor ships 8 are bonded on the film-like adhesive. A gap communicating with a through-hole is defined between the film-like adhesive and bonding sheet. A ship electrode is connected electrically to the inner connection part (step c). The laminate is placed in a transfer mold die and sealed with the use of semiconductor sealing epoxy resin 9 step d). A ball 10 is placed and melted on the outer connection part (step e), and the laminate is separated and decomposed into individual semiconductor packages by punching.