RETICLE HAVING COVER PATTERN AND ITS PRODUCTION

摘要

PROBLEM TO BE SOLVED: To minimize the cover pattern to be transferred onto a wafer at the time of step-and-repeat exposure and to minimize the peeling of a metallic film when dicing of a chip by forming the shape of the cover pattern of a reticle to a shape approximate to a pattern shape requiring a cover in an auxilia ry pattern. SOLUTION: The auxiliary pattern 2 is arranged on the left side of a block 1 of a main pattern. The cover pattern 5 for preventing the invalidation of the exposure of the auxiliary pattern 2 by covering the auxiliary pattern 2 is arranged in the position on the opposite side of the auxiliary pattern 2 across the block 1 of the main pattern. The cover pattern 5 is formed to the shape approximate to the shape of a wiring pattern 4. In such a case, the cover pattern 5 is formed as the pattern made slightly larger in size than the wiring pattern 4 by taking the variation of a process into consideration.