| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser beam machine capable of sufficiently bringing out a capacity of a machining laser light source and executing laser machining in a short time and with excellent accuracy. SOLUTION: In a laser beam machine which emits machining laser on a semiconductive device 21 as 'an object to be machined' placed on a stage 22 and executes machining of a fuse as 'a part to be machined', an energy value or an oscillating pulse width of a machining laser is detected, and a repeated frequency when the detected value comes not to satisfy a machinable rated value is specified as an upper limit of a machinable repeated frequency, and oscillating of the machining laser is executed so as to become the upper limit. |
