发明名称 TENSION RELAXING ELECTRONIC COMPONENT, TENSION RELAXING PRINTED CIRCUIT BOARD, AND TENSION RELAXING ELECTRONIC COMPONENT MOUNTER
摘要 <p>PROBLEM TO BE SOLVED: To provide a tension relaxing electronic component, a tension relaxing printed circuit board, and a tension relaxing electronic component mounter capable of preventing the breakage of package and connecting sections caused by the differences in thermal expansion coefficients between an electronic component, such as LSI chip, a semiconductor package and the like and a printed circuit board. SOLUTION: An electrode 14 is formed on the surface of a printed circuit board side, on which an electronic componeint 13 comprising an LSI 11 and a ceramic carrier 12 is mounted and the relaxation structure 15 comprising a electrical conductive adhesion is formed on each electrode 14. The relaxing structure which absorbs stresses caused by the differences in the thermal expansion coefficients makes it possible to prevent failures during the heating process of the electronic component 13 mounted on the printed circuit board.</p>
申请公布号 JPH11224891(A) 申请公布日期 1999.08.17
申请号 JP19980324212 申请日期 1998.11.13
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKEZAWA HIROTERU;TSUKAMOTO KATSUHIDE;ITAGAKI MINEHIRO;BESSHO YOSHIHIRO;HATANAKA HIDEO;FUKUMURA TAIJI;EDA KAZUO;ISHIDA TORU
分类号 H01L23/12;H01L21/60;H01L23/32;H01L23/498;H05K1/02;H05K3/10;H05K3/32;H05K3/34;(IPC1-7):H01L21/60 主分类号 H01L23/12
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