发明名称 Linear conditioner apparatus for a chemical mechanical polishing system
摘要 A conditioner apparatus uses one or more linear conditioners. The linear conditioners extend from the edge of the polishing pad almost to the center of the pad. The conditioner apparatus may use two conditioner rods located on either side of a radial segment. The rods gimbal so that if one rod rises, the other rod is forced downwardly. In addition, the rods can pivot independently about a lateral axis, but they cannot pivot around the vertical axis. The linear conditioners may be actuated by a piezoelectric member or swept by an arm toward and away from the center of the polishing pad.
申请公布号 US5938507(A) 申请公布日期 1999.08.17
申请号 US19950549480 申请日期 1995.10.27
申请人 APPLIED MATERIALS, INC. 发明人 KO, SEN-HOU;RAFLOSKI, RICHARD V.;NYSTROM, JAMES C.;PRINCE, JOHN;GOLDSPIEL, ALFRED A.;BLUMENKRANZ, STEPHEN J.;BIRANG, MANOOCHER
分类号 B24B37/00;B24B37/04;H01L21/304;(IPC1-7):B24B21/18 主分类号 B24B37/00
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