MANUFACTURE OF SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor chip and a semiconductor chip module, capable of easily performing manufacture without interrupting a manufacturing process by insulating the side faces of the respective semiconductor chips in a state of uncut wafer. SOLUTION: A first via hole 32 is formed on the upper surface of an uncut wafer 20, an insulating material is filled, the side faces of the respective semiconductor chips 28 are insulated, and a conductive layer 44 connected to the pads of the respective semiconductor chips 28 and the insulated side faces is formed. Then the wafer 20 is cut, the laminatable semiconductor chips 50 are formed, and the semiconductor chip module is formed by laminating the semiconductor chips 50.