| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device comprising super-position measurement mark together with its manufacturing method, wherein accuracy and reproducibility of superposition measurement is improved. SOLUTION: In a mark for measuring superposition of first and second patterns, the first and second patterns comprise an outside box mark 1 and an inside box mark 2, with at least one formed into a square formed of rectangular or circular dots. The square pattern of rectangular or circular dots is embedded with a conductive material. An embedded metal is completely embedded with at least one box mark of a superposition measurement mark, comprising the outside box mark 1 and the inside box mark 2 which is a square formed of rectangular or circular dots, for optically smooth sidewall of the pattern, resulting in improved superposition measurement precision and measurement reproducibility. |
