| 摘要 |
A packaged semiconductor device and an electronic device module having such packaged semiconductor device. The package semiconductor device includes a semiconductor wafer chip, electrode leads, connection conductors for interconnecting the chip and the electrode leads, a heat sink block attached to the semiconductor wafer chip and a mold block. The mold block has a first mold block portion for molding the semiconductor wafer chip, electrode leads, connection conductors and a first portion of the heat sink block relatively nearer to the semiconductor wafer chip and a second molde block portion for molding a second portion of the heat sink block relatively farther from the semiconductor wafer chip. The second mold block portion is smaller than the first mold block portion and extending from the mold block portion so that the mold block has, as whole, has such a shape as having a raised land on its one side projecting in an outward direction. The second portion of the heat sink block has a surface exposed from the second mold block portion. |
