| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which high heat dissipation efficiency is attained by touching the exposed side face of a heat sink to a printed wiring board mounting the heat sink, additional labor for applying adhesive, or the like, is not required in mounting onto the printed wiring board and the wiring formed at the semiconductor device mounting part has no risk of being short-circuited after mounting. SOLUTION: An electric insulating layer 10 is formed of an alumina spray film on the exposed side face 4a of a heat sink 4 to constitute a resin sealed semiconductor device. The exposed side face 4a of the heat sink 4 touches a printed circuit board under mounted state to transmits heat from a semiconductor die through the heat sink 4 to the printed circuit board thus increasing the substantial heat dissipation area thus enhancing the heat dissipation performance. Even if the exposed side face 4a of the heat sink 4 touches the wiring on the printed circuit board, they are insulated electrically through the electric insulating layer 10 and have no risk of being short-circuited. The electric insulating layer 10 formed of an alumina spray film exhibits excellent electric insulation and heat resistance. |
