Circuit board cavity manufacture technique

摘要

The procedure includes generating an electric potential in a metallic coil (2) and penetrating the card (1) with the reamer (8) orthogonally in the area near the contacts (2a) and checking the electric potential of the tool to detect variations in potential, associated with the reference position (Po) of the tool w.r.t the card in contact with this contact. The next step is to continue the tool penetration along a course determined by this reference position right up to the depth of the machining (P1). At this position, the next step is to machine the desired cavity (3) by translating the tool parallel to the card.