发明名称 |
Dielectric capacitor especially a ferroelectric capacitor for a RAM |
摘要 |
A dielectric capacitor (18-20), buried in a trench (17a, 17b) in an interlevel insulation (17), is new. Independent claims are also included for the following: (a) a process for producing the above buried dielectric capacitor (18-20); and (b) a dielectric memory comprising the above buried dielectric capacitor (18-20). Preferred Features: The capacitor dielectric film (19) comprises: (i) a ferroelectric dielectric selected from Bi2SrTa2O9 (SBT), Bi2SrTa2-xNbxO9 (SBTN), Pb(Zr, Ti)O3 (PZT) or (Pb, La)(Zr, Ti)O3 (PLZT); or (ii) a high dielectric constant dielectric selected from Ta2O5, (Ba, Sr)TiO3 (BST) or SrTiO3 (STO).
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申请公布号 |
DE19904781(A1) |
申请公布日期 |
1999.08.12 |
申请号 |
DE19991004781 |
申请日期 |
1999.02.05 |
申请人 |
SONY CORP., TOKIO/TOKYO, JP |
发明人 |
OCHIAI, AKIHIKO, TOKIO/TOKYO, JP;TANAKA, MASAHIRO, TOKIO/TOKYO, JP |
分类号 |
H01L21/02;H01L21/8242;(IPC1-7):H01G4/008;H01G4/08;H01G4/33;H01L27/105;H01L21/823 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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