发明名称 Dielectric capacitor especially a ferroelectric capacitor for a RAM
摘要 A dielectric capacitor (18-20), buried in a trench (17a, 17b) in an interlevel insulation (17), is new. Independent claims are also included for the following: (a) a process for producing the above buried dielectric capacitor (18-20); and (b) a dielectric memory comprising the above buried dielectric capacitor (18-20). Preferred Features: The capacitor dielectric film (19) comprises: (i) a ferroelectric dielectric selected from Bi2SrTa2O9 (SBT), Bi2SrTa2-xNbxO9 (SBTN), Pb(Zr, Ti)O3 (PZT) or (Pb, La)(Zr, Ti)O3 (PLZT); or (ii) a high dielectric constant dielectric selected from Ta2O5, (Ba, Sr)TiO3 (BST) or SrTiO3 (STO).
申请公布号 DE19904781(A1) 申请公布日期 1999.08.12
申请号 DE19991004781 申请日期 1999.02.05
申请人 SONY CORP., TOKIO/TOKYO, JP 发明人 OCHIAI, AKIHIKO, TOKIO/TOKYO, JP;TANAKA, MASAHIRO, TOKIO/TOKYO, JP
分类号 H01L21/02;H01L21/8242;(IPC1-7):H01G4/008;H01G4/08;H01G4/33;H01L27/105;H01L21/823 主分类号 H01L21/02
代理机构 代理人
主权项
地址