| 摘要 |
An electronic device package comprises a semiconductor device 10 having electrodes 11, 12, 13, 14 on first and second opposing faces. A substrate 60 has a number of metal tracks 70, 71 bonded to the electrodes 13, 14 of the first face of the device. A metal lead frame 30, 31 has at least one metal track bonded to at least one of the electrodes of the second face of the device 10. Bonding to the electrodes may be by bumps of solder or another alloy. 40, 41, 42, 43 are either solder patches or patches of a conductive polymer, to ensure good electrical connection. The device could be a full bridge rectifier and more than one device may be connected between the substrate and the lead frame. |
