| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable an electronic part such as a semiconductor chip mounted on a mounting board to be enhanced in connection reliability by a method wherein an insulating layer which is formed of adhesive agent that has a specific storage elastic modulus at a prescribed temperature and is filled with inorganic filler is provided between the outermost wiring layer and a wiring layer closest to the outermost wiring layer. SOLUTION: A multilayer wiring board is equipped with wiring layers which contain the outermost wiring layer as a mounting board, a conductive hole provided in electrically connect the wiring layers together, and an insulating layer which is formed of adhesive agent that has a storage elastic modulus of 10 to 2000 MPa at 25 deg.C and 1 to 460 MPa at 170 deg.C and is filled with inorganic filler is provided between the outermost wiring layer and a wiring layer nearest to the outermost wiring layer. By this setup, the insulating layer of the outermost layer of the mounting board is formed of adhesive agent of low elastic modulus and inorganic filler, a board electrode is restrained from being buried much in the board by the inorganic filler dispersed into the adhesive agent after the board electrode is connected, so that a circuit board is markedly enhanced in connection reliability.</p> |
