SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable thinning, and improve coplanarity and reliability. SOLUTION: In order to restrain the warpage of a semiconductor package of overcoating structure, when the thermal expansion coefficient of a wiring board 11 is set toαs, the Young's modulus to Es, the thickness set to Hs, the thermal expansion coefficient of a resin layer 13 toαr, the Young's modulus to Er, and the thickness to Hr, respectively and a value of (αr.Er.Hr)/(αs.Es.Hs) to be at least about 0.6. By adopting such a structure, stresses acting on the semiconductor package can be relieved effectively, and the coplanarity of the semiconductor package can be improved.