| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition having excellent heat resistance and a solvent drying property and useful for an adhesive film by including a siloxane-modified polyamideimide resin and a thermosetting resin component. SOLUTION: This composition is obtained by including (A) 100 pts.wt. of a siloxane-modified polyamideimide resin and (B) 1-150 pts.wt. of a thermosetting resin component. Preferably, the component A is obtained by reacting a mixture containing diimidedicarboxylic acids of formula I (R1 is a group of formula II; X is a group of formula III, or the like) and formula IV R2 is a group of formula V; R3 and R4 are each a bifunctional organic group; R5 to R8 are each an alkyl, phenyl, or the like; (n) is 1-50} obtained by reacting a mixture of a diamine having >=3 aromatic rings and a siloxane diamine with a trimellitic anhydride with an aromatic diisocyanate of the formula: OCN-R9 -NCO (R9 is a group of formula IV, or the like), and the component B is preferably an epoxy resin having >=2 glycidyl groups. |
