ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE, PART FOR SEMICONDUCTOR-INTEGRATED-CIRCUIT CONNECTING SUBSTRATE AND SEMICONDUCTOR DEVICE USING THIS PART

摘要

PROBLEM TO BE SOLVED: To improve reflow resistance, thermal cycle property and processing property, by specifying the thickness of adhesive layer in an adhesive sheet for a semiconductor device having the laminated layer comprising at least one or more protecting layers and an adhesive layer. SOLUTION: The adhesive sheet for a semiconductor device has the constitution having the laminated body comprising at least one or more layers of protecting films 24 and an adhesive layer 23. For example the sheet corresponds to the two-layer constitution of protecting film layer 24/adhesive layer 23 or the three layer constitution of protecting film layer 24/adhesive layer 23/protecting film layer 24. The thickness of one adhesive layer 23 is in the range of 10μm-250μm based on stress relief and handling. The protecting film layer 24 is the film, wherein the mold release of silicone or fluorochemical material or the like is performed. Furthermore, it is recommendable that the polyester film wherein the mold release is performed is excellent in heat resistance.