| 摘要 |
This invention relates generally to a solution for electroless deposition of gold, and more particularly to a cyanide-free electroless gold solution that can be replenished by the addition of a solution of a non-cyanide complex of gold. The operating temperature range for the plating solution of the present invention ranges from about 40 DEG to about 70 DEG C. The opportunity to deposit gold at such low operating temperatures is especially beneficial for plating devices which cannot withstand the higher temperatures required for existing electroless gold solutions. The relatively low operating temperatures also provide for significant energy savings and increased operator comfort and safety as compared to existing electroless gold solutions.
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