| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chemical/mechanical flattening device improving reliability in a manufacture environment and a method reducing a cost for polishing each wafer. SOLUTION: A chemical/mechanical flattening device comprises a roller, wafer, carrier, arm, carrier constitutional body, adjusting arm, and an end effect piece. A slurry feed distribution system 51 as constitutional element of the chemical/mechanical flatting device comprises a check valve 52, diaphragm pump 53, check valve 54, back pressure valve 55, and a feed distribution bar 58. In the diaphragm pump 53, an accurate capacity of a abrasive according to each pumping cycle is supplied, without an influence of an input pressure. The check valves 52, 54, prevent a reverse flow of the abrasive through the diaphragm pump 53. In the back pressure valve 55, by preventing a flow of the abrasive during a down stroke of the diaphragm pump 53, a pressure difference in the whole check valve 54 is generated. The abrasive is distributed from the feed distribution bar 58 onto a polishing medium.</p> |
