MANUFACTURE OF SCANNING ELECTRON MICROSCOPE SYSTEM AND INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a method and system for analyzing a profile of wafer strength comprising a step where a wafer is scanned for generating a scan signal. SOLUTION: Relating to a method and a system for analyzing a substrate (for example, 120), a step for scanning the substrate (for example, 120) is composed by generating a strength signal representing a general appearance of a wafer (for example, 120). As other elements contributing to the strength signal, chemical composition and electric state of a feature scanned on the substrate (for example, 120) may be listed. For evaluation of the substrate (for example, 120), the scanned signal is compared to a reference signal for correlation. Further, the method and system may be applied to a method for manufacturing a wafer (for example, 120) for improved manufacture quality of a product.