发明名称 PRODUCTION OF COPPER STOCK HAVING POROUS COPPER LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method capable of efficiently producing a copper stock having a porous copper layer upon a copper substrate surface of various shapes, where copper powder is bonded via copper to the substrate surface and other copper powder, and a high heat exchanging efficiency. SOLUTION: This method is provided with stages; (a) copper powder is temporarily bonded with an org. binder to the surface of a substrate consisting of copper or a copper alloy to prepare a pretreated stock; (b) the stock to be pretreated is held under heating in an oxidizing atmosphere to form an oxidized stock having a structure in which the copper powder and the substrate surface and each copper powder are cross-linking by oxide formed on each surface; and (c) the oxidized stock is held under heating in a reducing atmosphere to form a porous copper layer on the substrate surface where the copper powder is bonded to the substrate surface or to other copper powder by a metallic bond.
申请公布号 JPH11217679(A) 申请公布日期 1999.08.10
申请号 JP19980020023 申请日期 1998.01.30
申请人 MITSUBISHI MATERIALS CORP 发明人 HOSHINO KOJI;CHO TOSHIYUKI;WAKITA SABURO
分类号 F28F1/12;B21D53/06;B22F1/02;C23C24/08;(IPC1-7):C23C24/08 主分类号 F28F1/12
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