IC package and IC probe card with organic substrate

摘要

An IC package includes an IC chip substrate having a first surface on which a plurality of electrodes are formed, and an organic substrate having a first surface on which a plurality of bump electrodes are provided. The organic substrate is combined with the IC chip substrate. Each of the bump electrodes is in contact with a corresponding one of the electrodes on the IC chip substrate. The organic substrate has a plurality of through holes and metallization patterns electrically connecting each of the bump electrodes to a corresponding one of the through holes.