发明名称 SUBSTRATE PLACING STAND SURFACE PROTECTING BOARD, METHOD FOR CLEANING PROCESSING CHAMBER, AND METHOD FOR CLEANING SUBSTRATE PLACING STAND
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate placing stand surface protecting board on which particles will not be generated, and a method for cleaning a processing chamber and the substrate placing stand by using this board at cleaning. SOLUTION: The cleaning side surface part of a substrate placing stand surface protecting board 27 or the entirety is formed of silicon carbide in which micro-cracks 4 is substantially non-existent, and this substrate placing stand surface protecting board 27 is set on a substrate placing stand 31, for example, a site 25 of the substrate placing stand 31 where a substrate should be installed. Thus, a cleaning processing for removing deposit 30 from surrounding parts 26 of the site 25 can be attained without generating particles from the protecting board 27.</p>
申请公布号 JPH11219939(A) 申请公布日期 1999.08.10
申请号 JP19980023007 申请日期 1998.02.04
申请人 TOKYO ELECTRON LTD 发明人 KAWANAMI HIROSHI
分类号 C23C14/00;C23C16/42;C23C16/44;H01L21/205;H01L21/302;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/306 主分类号 C23C14/00
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