发明名称 |
Processo para a fabricação de um elemento portador para para chips semicondutores |
摘要 |
A carrier element for a semiconductor chip (23), in particular for mounting in chip cards, has a substrate (15) that carries the chip (23) and a reinforcing foil (10) laminated on the side of the substrate (15) that carries the chip (23). The reinforcing foil (10) has a recess (14) for receiving the chip (23) and its connection lines (24), whose edge is provided with a frame (12) that forms a single piece with the foil (10). |
申请公布号 |
BR9709717(A) |
申请公布日期 |
1999.08.10 |
申请号 |
BR19979709717 |
申请日期 |
1997.06.10 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
MICHAEL HUBER;PETER STAPKA;DETLEF HOUDEAU;JUERGEN FISCHER;JOSEF HEITZER;HELMUT GRAF |
分类号 |
G06K19/077;H01L23/12;H01L23/16;H01L23/24;H01L23/28;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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