| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device, in which the mount of light emitted to the outside from a light-emitting element is increased. SOLUTION: A light-emitting diode lamp 1 is constituted by packaging a light-emitting element 2 by a molding section 8, which has a frame 5 having a recess 5b formed at the front end of one lead terminal 4 in a pair of lead terminals 3, 4 and the light-emitting element 2 which is die-bonded with the recess 5b, while being wire-bonded with one lead terminal 3 and the frame 5 by metal wires 6, 7, in which a front end section is formed into an approximately hemispherical-shaped lens 9 and which is made of a transparent or translucent synthetic resin, and the light-emitting element 2 is die-bonded with the recess 5b of the frame 5 and white paste 11 is used as a bonding material. A material, in which a proper amount of boron nitride(BN) is mixed into a transparent epoxy resin, is employed as a white paste 11. |
