| 摘要 |
Special probe pads are formed within the core of an integrated circuit, such as an ASIC, to provide direct access to internal circuitry for conducting failure analysis. For example, internal probe pads can be provided around an embedded RAM core for bit mapping the RAM core if necessary. An improved probe card is described to provide for accessing these internal probe pads using automated probing machines. The internal probe pads, preferably smaller in size than wire bonding pads, are located in available interstices on the die, preferably without increasing silicon area. Multiplexers can be used to isolate these probe pads during normal operation of the integrated circuit.
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