| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of hermetically sealing a package which is low cost and of a light light-weight and is non-conductive. SOLUTION: This method is constituted of a step for forming a metal covering surface 21 on a substrate 20, a step for selectively etching the substrate 20, and forming an etching widow 22, a step for coating the substrate 20 whit thin-layered material composed of a metal, after the etching step has been completed, a step for selectively etching the material composed of a metal on the substrate 20 except the etching window 22 for arranging a waveguide window 26 after the coating step have been completed, a step for selectively treating a left part of a material comprising of a metal of the waveguide window for making the material composed of the metal non-conductive after the etching step has been completed, and a step for bonding the substrate 20 by sealing the substrate in a metal carrier having a waveguide. Cost is reduced by using this hermetic sealing method of a package. |
