LOW-PRESSURE WAFER BONDING SYSTEM,申请号JP19980033587-传众专利搜索

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发明名称	LOW-PRESSURE WAFER BONDING SYSTEM
摘要
申请公布号	JPH11219872(A)	申请公布日期	1999.08.10
申请号	JP19980033587	申请日期	1998.01.30
申请人	MITSUBISHI MATERIALS SILICON CORP	发明人	KAWAMOTO TOSHIRO;FUNADA SHUICHI;MAEDA TAKESHI;KOBAYASHI TATSUNOBU
分类号	H01L21/02;(IPC1-7):H01L21/02	主分类号	H01L21/02
代理机构		代理人
主权项
地址

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