发明名称 |
Resin composition and its use in production of multilayer printed circuit board |
摘要 |
A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.
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申请公布号 |
US5935452(A) |
申请公布日期 |
1999.08.10 |
申请号 |
US19980188905 |
申请日期 |
1998.11.10 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
INADA, TEIICHI;TSURU, YOSHIYUKI;TAKANEZAWA, SHIN |
分类号 |
C08L13/00;C08L33/08;C08L63/00;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):H01B13/00 |
主分类号 |
C08L13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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