| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device, wherein uniformizing of the attitude of light-emitting elements causes stable light-orientation property and less molding processes leads to improved productivity. SOLUTION: A semiconductor light-emitting element 1 of flip-chip type is mounted on a Zener diode 7 for electrostatic protection, and p-side and n-side electrodes 3 and 2 of the semiconductor light-emitting element 1 are connected for conduction, to electrodes 7b and 7a of the Zener diode 7, with a surface of a side opposite to the mounting surface side as a main light extracting surface. Here, the p-side and p-side electrodes 3 and 2 are formed on the surfaces of a p-type layer 1c and n-type layer 1b of the semiconductor light-emitting element 1, respectively, and depending on the thickness of these electrodes 3 and 2, a gap with out shorting interference among the semiconductor light- emitting element 1, the mounting surface, and its electrode is formed. |
