| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device by preventing the shortage of molding inside a cavity, when a resin encapsulating operation is performed, and to improve the workability of a molding operation. SOLUTION: This semiconductor device consists of a tab 1a where a semiconductor chip 2 is mounted, a tab-suspension lead 1i which supports the tab 1a, a plurality of inner leads which are connected electrically by the pad of the semiconductor chip 2 and a bonding wire, a resin main body part 3 which is formed by resin encapsulating the semiconductor chip 2, a plurality of outer leads 1c which is coupled to the inner lead and protruding to outer part from the resin main body part 3, and a groove-like air vent part 1d which is the air path provided on the tab-suspension lead 1i corresponding to the place ranging from the cavity of a molding mold to its outside part. The shortage of mold in the cavity can be prevented by sending out the air in the cavity to the outside through the air vent 1d, when resin is injected in a molding process.</p> |
