| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which a semiconductor element will not move vertically in a molding cast due to pressure of molten resin or the like, at encapsulation. SOLUTION: In a semiconductor device 1, a plurality of inner leads 13 are bonded to the surface of a semiconductor element 11 covered with a package 10. In this case, a bent part 17 is formed on inner leads 13' which are a part of a plurality of the inner leads 13, and the tip of the bent part 17 is exposed on the surface of the package 10. |
