| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable fine round solder bumps to be enhanced in manufacturing yield by a method wherein a protective film-void part smaller than a protective film-less space which serves as a solder pad is formed adjacent to a solder bump electrode pad and being connected to the protective film empty space. SOLUTION: A functional insulating film 2 and a conductive electrode film 3 provided with an insulating protective film-void part 7 continuously joined to a solder bump forming land which is connected to an insulating protective film-less space 5 that serves as a solder bump forming land are formed on an electric insulating board 1. A solder bump electrode 6 is formed on the conductive electrode film 3, and the functional insulating film 2 and the conductive electrode film 3 are covered with a protective insulating film 4. The insulating protective film-void part 7 provided adjacent to the insulating protective film-less space 5 is set smaller than the insulating protective film-less space 5. By this setup, flux flowing in a horizontal direction is restrained from coming into contact with other flux applied to an adjacent solder bump forming pad, and a solder bridge is prevented from being formed.</p> |
