SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To curtail the planar size of a semiconductor device. SOLUTION: This semiconductor device has a semiconductor chip 2 where an electrode 6 is made on the main face, a a sealing body 7 which seals the semiconductor chip 2, a lead 3 which is connected electrically with the electrode 6 of the semiconductor chip 2, and an electrode 4 for external connection which is positioned outside the sealing body 7b and is made of a part of the lead. In this case, the electrode 4 for external connection is arranged within the projecting region of the main face of the semiconductor chip 2. The electrode 4 for external connection is made in such a form as to project from the sealing body 7.